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Author Archives: WorkingBear
Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly
“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability. Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) … Continue reading
Apr13
Red Dye Penetration Test to check for BGA solder joint cracking
The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on … Continue reading
Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading
Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress
Manufacturing processes that may result in high stress in factories Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.
Mar29
Why BGA soldering ball always crack(11)? Stress is the Biggest Culprit in Causing BGA Solder Joint Cracks
The earlier sections of the article that Workingbear spent a lot of time discussing how to strengthen the bonding force of PCBAs and increase the stress resistance of electronic products. Now, we can finally talk about the biggest culprit causing … Continue reading
