Author Archives: WorkingBear


May03
Trouble Shooting Guide for Plastic Injection

Trouble Suggested Remedies (Solutions) DIMENSIONAL PROBLEMS Shot-to-shot dimensional variations Increase injection pressure Maintain uniform pad (cushion) Repair leaking back flow value if pad cannot be maintained Increase screw forward time Maintain uniform cycle Eliminate un-melted particles (see below) Use larger … Continue reading

Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering

Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading

Mar09
What Process Impact of Substituting SMDs with Paste-In-Hole components?

One day, my manager asked me a question: “Will changing the components from SMDs (Surface Mount Devices) to THDs (Through Hole Devices) and using the PIH (Paste-In-Hole) process affect the process and design?” I later realized that the question aimed … Continue reading

Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution

Today, most of electronic components are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading

Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

The trend in the electronics industry is toward smaller and smaller SMD components, with sizes such as 0402, 0201, and even 01005 becoming common (Note 1). Additionally, the pitch between pins on ICs has decreased to a fine pitch of … Continue reading