Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) Carrier Component drop/detachment Concept DFx EDX/EDS/SEM ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) HotBar ICT IMC LCM LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Red Dye Penetration Reliability Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
May03
Trouble Shooting Guide for Plastic Injection
Trouble Suggested Remedies (Solutions) DIMENSIONAL PROBLEMS Shot-to-shot dimensional variations Increase injection pressure Maintain uniform pad (cushion) Repair leaking back flow value if pad cannot be maintained Increase screw forward time Maintain uniform cycle Eliminate un-melted particles (see below) Use larger … Continue reading
Apr07
Solution to Prevent Component Drops During Second Time Reflow Soldering
Due to the rapid growth of mobile phone technology, the Electronic Manufacturing Service (EMS) in mainland China sometimes faces serious labor shortages. Additionally, Industry 4.0 promotes the need for factory automation in EMS. As a result, certain parts that cannot … Continue reading
Mar09
What Process Impact of Substituting SMDs with Paste-In-Hole components?
One day, my manager asked me a question: “Will changing the components from SMDs (Surface Mount Devices) to THDs (Through Hole Devices) and using the PIH (Paste-In-Hole) process affect the process and design?” I later realized that the question aimed … Continue reading
Feb01
Solder Preforms – Another Choice for Solder Volume Increasing Solution
Today, most of electronic components are developed into smaller size. The small chips are downsized from 1206 to 0805, 0603, 0402, 0201, even to 01005. The size of chip is smaller; the required solder volume is less. Moreover, the required … Continue reading
Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution
The trend in the electronics industry is toward smaller and smaller SMD components, with sizes such as 0402, 0201, and even 01005 becoming common (Note 1). Additionally, the pitch between pins on ICs has decreased to a fine pitch of … Continue reading