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Author Archives: WorkingBear
Feb15
Why BGA soldering ball always crack(4)? Using "copper" base material as the surface finish for PCB
Following last discussion, we learned that solder cracking is caused when the stress placed upon it exceeds the strength of the bonding force. However, it’s possible to address this issue by increasing the bonding force of the printed circuit board … Continue reading
Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading
Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading
Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
This article will talk about the composition of the PCBA bonding-force. There are numerous factors and elements involved in PCBA bonding force. However, Workingbear believes that we can utilize the findings of the red dye test to examine this issue. … Continue reading
Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force
What is the actual root cause of BGA solder ball cracking? Stress is higher than its bonding-forces. The root cause of BGA solder ball cracked is stress higher than bonding-forces. Stress is higher than bonding-force is the certain result of … Continue reading
