Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
Aug01
What is OSP (Organic Solderability Preservative) Surface Treatment for PCB? What are its Pros and Cons?
OSP (Organic Solderability Preservative) is a special chemical coating applied to the surface of copper on a PCB (Printed Circuit Board). This coating forms a thin protective film that keeps the bare copper from rusting or corroding when it’s stored. … Continue reading
Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?
WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading
Jul18
Why are there holes on the PCB? What is PTH, NPTH and vias?
If you ever get the chance to hold a printed circuit board (PCB) in your hands and take a closer look, you’ll notice there are many different-sized holes. When you hold it up to the light, you’ll even see lots … Continue reading
Jul13
What is blind hole, buried hole and plating hole for PCB?
In the early response to a user’s question, WorkingBear mistakenly mixed up the terms “blind hole” and “buried hole” when talking about PCBs. To prevent similar errors in the future, WorkingBear took the initiative to study some books about PCBs … Continue reading
Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End
Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading
