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Author Archives: WorkingBear
Feb20
What is IMC (Intermetallic Compound)? How does IMC relate to PCB solder joint strength? Are there IPC standards for IMC thickness?
In the assembly and soldering process of printed circuit boards (PCBs), we often hear engineers or lab reports mentioning the term “IMC.” But what exactly is IMC? What role does IMC play in the PCB assembly (PCBA) soldering process? Does … Continue reading
Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading
Jan30
Problem Analysis and Solving: 8D report
The “8D report” is a tool commonly used in the electronics assembly industry for “problem analysis and solving.” Due to its systematic and clear steps, the “8D report” is often utilized in responding to customer complaint cases. The term “8D” … Continue reading
Jan23
Why a BOM (Bill of Materials) is Critical in Electronic Product Development
A Bill of Materials (BOM) is a list of materials required for the production of an electronic product. It serves as an important bridge between the designer, manufacturer, and supplier. The BOM includes all the components, devices, and materials used … Continue reading