Author Archives: WorkingBear


Nov28
When does SMT require Reflow Carriers and Full Process Carriers?

What is an SMT Reflow Carrier? Why is it sometimes necessary in SMT production? And when do we need an SMT Full Process Carrier? Are there situations where neither is required? The so-called “SMT reflow carriers or reflow templates” are … Continue reading

Nov21
Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX

This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading

Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?

The “SMT dispensing” process,  also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB).  The term “SMT Red Glue” … Continue reading

Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH

The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading

Oct26
5 Key PCB Layout Considerations for Efficient Circuit Board Assembly and Soldering Production Processes

When designing a PCB layout, various questions inevitably arise. Is this PCB best suited for a single-layer, double-layer, or multi-layer configuration? How should you protect against ESD/EMI? Will the printed circuit board assembly (PCBA) use a single-sided or double-sided process? … Continue reading