This is an X-ray inspection image of an MCU’s BGA soldering that failed after reflow. The owner mentioned that the BGA package was not functioning, but when pressing on the MCU, it would temporarily work again. Since Workingbear didn’t have the chance to see the faulty product in person, the assessment is based on this image alone. However, from the overall description given, this appears to be a typical case of BGA non-wetted. Can you spot the problem with the solder balls from the X-ray image above?
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