As an engineer in the electronics manufacturing industry, have you ever encountered the need to rework a printed circuit board (PCB) to remove the solder mask? If so, how did you approach this problem?
Traditionally, the solder mask is manually removed using a knife or hand grinding tool. However, this method often results in damage to the traces on the PCB, leading to a high scrap rate for both the PCB and PCB assembly.
WorkingBear would like to introduce a new method of removing the solder mask using a laser machine, which is highly efficient and reliable. By selecting the appropriate laser power, the solder mask can be removed without damaging the copper underneath. read more…》
The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and prompt corrective action by both the supplier and customer is essential for achieving continuous process improvement.
Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, inspecting the soldering result is challenging because the solder joints are hidden under the BGA body, and sometimes even 2D X-Ray inspection is insufficient. (5Dx or angle rotation X-Ray might be able to inspect BGA soldering quality, but these methods are expensive.)
Do you know how vendor ensure that their products are not damaged during shipping due to handling by transporters or delivery personnel? Reputable vendors put effort into designing and selecting suitable packaging materials for shipping to ensure the quality of their products. This article will introduce how vendor test whether their cardboard packaging meets general shipping requirements.
