Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials

post on April 28, 2023

PCB matereial composition structure

The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has been added to the PCB material in large quantities to improve its heat resistance.

We can imagine copper foil as the blood vessels in the human body, used to transport blood, while in PCBs, they are used to transmit electronic signals. Reinforcement materials can be imagined as the bones in the human body, used to support and strengthen PCBs so that they don’t collapse. And the resin can be thought of as the muscles in the human body, which are the main components of PCBs.

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Design, PCB/FPC/PTF     WorkingBear    Views (2,412)     comment (0)
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Apr25
Four Solutions for Quickly Removing labels from Carton and Devices

post on April 25, 2023

At Workbearing’s electronic manufacturing service (EMS) factory and warehouse, products often need to be reworked for various reasons, such as customer requests or converting products for inventory purposes. While removing labels is not the most crucial task in the rework process, there is a need for a better and efficient way to remove labels without causing damage to the product or packaging box.

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Process     WorkingBear    Views (2,177)     comment (0)
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Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers

post on April 21, 2023

A parting line and gaps will appear between the joining surface of top and bottom molds in IC package

Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture.

Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory floor or production line, as well as any environment the components are exposed to after being removed from vacuum-sealed packaging.

Please note that liquid or solid water cannot be counted as part of humidity! In fact, the human body can feel humidity. In a high humidity environment, you can feel that sticky sensation, like when it’s about to rain but hasn’t started yet, and your whole body feels damp.

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Manufacture, Moisture Sensitive, Process, Quality, SMT     WorkingBear    Views (4,987)     comment (0)

Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly

post on April 18, 2023

“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability.

Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) than typical PCB materials. As a result, temperature cycling tests often cause relative displacement, leading to mechanical fatigue and problems such as solder joint detachment or cracking. Later, this Underfill technology was also widely used under some BGA packages to improve their reliability when soldered onto the PCB and to prevent them from falling or dropping.

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Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (6,036)     comment (0)
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Apr13
Red Dye Penetration Test to check for BGA solder joint cracking

post on April 13, 2023

簡介用紅墨水試驗 (Red Dye Penetration Test)查看BGA焊錫有否破裂

The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on the SMT of printed circuit board (PCB) assemblies, and can assist engineers in verifying the quality of electronic component soldering.

Because the Red Dye test is a destructive experiment, it is typically only used on assembled PCBs (printed circuit boards) that cannot be inspected for issues using other non-destructive methods. Additionally, it is almost exclusively used for analyzing ICs (integrated circuits) with BGA (Ball Grid Array) packaging because the solder joints are located beneath the component and cannot be visually inspected using optical instruments.

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Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (8,985)     comment (0)
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