The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of the solder paste adheres to the leads of the component, while most remains on the PCB’s solder pads. When these assemblies pass through a high-temperature reflow oven, the solder paste on the leads and PCB pads melts, securely attaching the component to the circuit board. This method can effectively replace traditional processes like wave soldering or hand soldering.
This process is also known by other names such as “Pin-In-Paste (PIP),” “Intrusive Reflow Soldering (IRS),” and “Reflow Of Through-hole (ROT).”