Feb06
Causes of Solder Empty and Tombstoning in Small Chip of Resistors and Capacitors

small chip tombstoneRecently, some people have asked about issues with solder empty in small chip SMD components like resistors and capacitors. Even after thoroughly checking the reflow oven profile settings and confirming everything is correct, solder empty still frequently occur with these components, often in fixed positions. Observations of the solder also don’t show any signs of non-wetting or de-wetting, leaving many puzzled.

In reality, the cause of solder empty in these components isn’t that hard to understand! It’s essentially the same reason tombstoning occurs. To put it simply, it all comes down to this: “The solder paste on the two terminal ends of the component melts at different times, resulting in uneven forces and causing one side to lift.”

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Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips

Two Major Potential Issues with ENIG Surface PCB Pads (Black Nickel and Phosphorus-Rich Layers) and How to Prevent Them

With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due to its simplicity and lower cost compared to other surface treatments, as well as its numerous advantages, including:

  1. Excellent reworkability: ENIG allows for multiple soldering processes without compromising quality.
  2. Superior flatness: Perfect for fine-pitch components.
  3. Strong resistance to oxidation: Suitable for long-term storage.
  4. Versatility: Can be used for contact circuits like keypads.

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Jan16
Inspection Methods for BGA Solder Ball Wettability and Soldering Defects

Inspection Methods for BGA Solder Ball Wettability and Soldering Defects

This is a summary post aimed at providing some guidance to newcomers in the electronics assembly field on methods for analyzing the solderability of BGA (Ball Grid Array) solder balls. Workingbear decided to write this after seeing someone ask about this topic in an online forum. Some of the content might overlap with topics already covered in previous blog posts.

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Jan09
Why Do Electronic Component Leads Turn Yellow, Purple, or Blue After Reflow? Causes and Solutions

Why Do Electronic Component Leads Turn Yellow, Purple, or Blue After Reflow? Causes and Solutions</strong

Workingbear recently received questions from readers about electronic component soldering leads turning yellow or showing discoloration (purple, blue, etc.) after going through the reflow oven. Why do the leads of components discolor after reflow? Does this discoloration affect product functionality? And how should we handle discolored components or assembled PCBs? Let’s dive into these questions for this article.

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Jan02
How to Monitor the Quality of Incoming Plastic Resin?

How to Monitor the Quality of Incoming Plastic Resin

This is a answer to a question from a community member asking about plastic quality control. The question was: “Can we rely solely on MI (Melt Index) values to monitor the quality of plastic resins? And does an increase in MI indicate plastic property degradation?” Many people believe there is no direct correlation between MI values and cracking in plastic products.

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