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Category Archives: SMT
May23
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
Apr25
How are decisions made regarding stencil thickness, aperture, and shape? How can solder beads be prevented?
A user asked: “How is the thickness of the stencil determined? What considerations are there for the shape of the stencil apertures?” The thickness of the stencil is mainly determined by the amount of solder paste needed for component soldering. … Continue reading
Apr02
Can Surface Mount Devices Run Through the Wave Soldering Without Falling Into the Pot?
In previous discussions, Workingbear introduced the “wave soldering” process, which was used in early day of PCBA soldering. SMT assembly, on the other hand, emerged later. Can wave soldering be used for Surface Mount Devices (SMDs) after SMT placement? Workingbear … Continue reading
Mar26
What is AOI? What Defects Can 2D AOI Detect in PCB Assembly?
AOI (Auto Optical Inspection) is an automated optical recognition system that has become widely used in the electronics industry for inspecting the quality of soldering, component placement accuracy and the presence of missing components on PCBA (Printed Circuit Board Assembly) … Continue reading
