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Category Archives: SMT
Jan09
Why Do Electronic Component Leads Turn Yellow, Purple, or Blue After Reflow? Causes and Solutions
Workingbear recently received questions from readers about electronic component soldering leads turning yellow or showing discoloration (purple, blue, etc.) after going through the reflow oven. Why do the leads of components discolor after reflow? Does this discoloration affect product functionality? … Continue reading
Nov07
The Benefits of Using “Mirrored Panelization” for PCBs
In the electronics assembly manufacturing industry, what we commonly refer to as a “Mirrored Panel Board” or “Flipped Panel Board” actually comes in two types. The first type is a different-side mirrored panel board, where one board’s top side and … Continue reading
Oct31
The Limitations of Using “Mirrored Panels” or “Flipped Panels” in SMT
We all know that when producing PCBs and PCBAs, multiple individual PCBs are usually combined into one larger panel, a process called panelization, to improve production efficiency. Typically, these individual boards are arranged in a neat and consistent manner with … Continue reading
Oct24
Causes and Prevention of PCB Warping and Bending After Reflow
A reader recently asked: “In surface mount assembly, PCBs often warp or bend after going through the reflow process, which can cause issues like open solder joints or tombstoning. How can we overcome this?” To be honest, the reasons behind … Continue reading
Oct17
Benefits and Drawbacks of Using Nitrogen (N2) in SMT Reflow Ovens: Optimizing Soldering Quality and Reducing Oxidation
The primary purpose of adding Nitrogen (N2) to the SMT reflow oven is to reduce oxidation on the soldering surface and improve the wettability of the solder joints. Nitrogen is a colorless, odorless, and chemically inactive gas. It belongs to … Continue reading
