Category Archives: Reliability


May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints

In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading

Feb06
Purpose of Using Lead-Free Low-Temperature Solder (LTS) SnBi, SnBiAg in Soldering

The alloy composition of lead-free LTS (Low Temperature Solder) usually includes the metal “bismuth (Bi)” in addition to tin (Sn) to lower its eutectic point. The commonly used lead-free solder SAC305 has a melting point of 217°C, while Sn64Bi35Ag1 has … Continue reading

Dec26
Another Option for Increasing Solder Volume in SMT – Solder Preforms

“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as … Continue reading

Aug17
An Option for Adding More Solder – Solder Preforms

“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading

May30
The Hidden Dangers of Using Overdue PCBs: Can Baking Salvage Them?

All materials actually have its shelf-life, some shorter and some longer than others. So what happens when expired materials are used? Think about what will happens when you eat expired food. What about using expired Printed Circuit Boards (PCBs)?