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Category Archives: Reliability
Jun12
Impact Drop Test Requirements in Electronic Product Development
During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases: Product Drop Test – Testing the device without packaging. Packagage Drop Test – Evaluating the … Continue reading
Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing
From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading
May29
Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions
Workingbear’s company was having a tough time with a strange issue: intermittent micro-short circuits inside the layers of the PCB. Since the shorts didn’t show up near any components, it was really hard to figure out what was wrong. Recently, … Continue reading
May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It
One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
