Seach This Blog
Tag Cloud
AOI Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LCM LTS Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Popcorn-Effect Problem analysis & solving Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Reliability
Jul31
What’s the Difference Between Quality and Reliability?
Do you know the difference between quality and reliability? These two terms often get confused, but if you dig deeper, they actually mean different things. So how do you tell them apart? (The following is just Workingbear’s personal opinion and … Continue reading
Jul24
Understanding ORT: What It Is and How It Differs from REL (Reliability)
ORT stands for Ongoing Reliability Test, and sometimes it’s written as Ongoing Reliability Testing. ORT is a very important quality control measure in electronics manufacturing. Its purpose is to continuously monitor the reliability of products during mass production, so that … Continue reading
Jun26
What is Environmental Stress Screening (ESS)?
Environmental Stress Screening (ESS) is a method used to apply certain environmental and operational stresses—such as power on/off cycles, bias voltage, pressure, thermal cycling, and vibration—to new or repaired products (usually electronics or components). The idea is to expose hidden … Continue reading
Jun12
Impact Drop Test Requirements in Electronic Product Development
During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases: Product Drop Test – Testing the device without packaging. Packagage Drop Test – Evaluating the … Continue reading
Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing
From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading
