Category Archives: Reliability
Nov11
OSP vs. ENIG: Which PCB Surface Finish Provides Stronger BGA Solder Joints?
Figure: OSP vs. ENIG: Which PCB Surface Finish Provides Stronger BGA Solder Joints? This article uses experimental data to demonstrate that solder joints on OSP-finished PCBs can have higher strength than those on ENIG-finished PCBs. The results also confirm that … Continue reading
Oct28
A Collection of Articles on Component Detachment and BGA Solder Joint Cracking
Figure: BGA solder joint craking: causes, analysis & reliability solutions. BGA solder joint cracking is one of the most challenging issues I’ve encountered throughout my career in electronics manufacturing. It’s also one of the topics that comes up most often … Continue reading
Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading
Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them
Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading
Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids
Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading
