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Category Archives: Quality
Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons
In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading
Feb20
PCB Popcorn Effect: Why it Happens and How to Stop It
The main reasons for PCB delamination or “popcorning” are primarily (1) moisture absorption and (2) excessive α2/Z-axis CTE (Coefficient of Thermal Expansion). Among these, moisture absorption is responsible for about 70% of delamination issues. Other factors, such as uneven thermal … Continue reading
Feb06
Causes of Solder Empty and Tombstoning in Small Chip of Resistors and Capacitors
Recently, some people have asked about issues with solder empty in small chip SMD components like resistors and capacitors. Even after thoroughly checking the reflow oven profile settings and confirming everything is correct, solder empty still frequently occur with these … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
