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Category Archives: Quality
			Jan30  
			8D Report: Problem Analysis and Solving
			
				The “8D report” is a tool commonly used in the electronics assembly industry for “problem analysis and solving.” Due to its systematic and clear steps, the “8D report” is often utilized in responding to customer complaint cases. The term “8D” … Continue reading
			Jan16  
			RSS or RTS? Which SMT Profile Should You Choose?
			
				Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading
			Jan09  
			What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow
			
				The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA … Continue reading
			Jan02  
			SMT Reflow Soldering Temperature Profiles Explanation and Precautions
			
				The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading


