Category Archives: Quality


Jun03
TQRDCE Performance Expectations and Review

This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and … Continue reading

May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading

May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading

May01
Why Do Screw Bosses Crack After Mold-In Screw Inserts? Common Causes and Solutions

This story is long-standing memory, but WorkingBear is documenting it here for reference and as a learning record. One day, we received a customer complaint regarding a product with a plastic housing that had cracked. The issue was visually striking, … Continue reading

Apr24
How to select a good actuator design for right angle connector?

As my personal feeling that Right-angle FPC ZIF connector is really more easily to use than Drawer type of ZIF connector. Even right-angle connector is good but do you know how to select a good design of this kind of … Continue reading