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Category Archives: Quality
			May23  
			How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
			
				BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
			May02  
			Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
			
				In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
			Mar26  
			What is AOI? What Defects Can 2D AOI Detect in PCB Assembly?
			
				AOI (Auto Optical Inspection) is an automated optical recognition system that has become widely used in the electronics industry for inspecting the quality of soldering, component placement accuracy and the presence of missing components on PCBA (Printed Circuit Board Assembly) … Continue reading
			Feb27  
			What is Graping Solder Defect in SMT Assembly? How to Fix it?
			
				In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading
			Feb15  
			NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
			
				Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading


