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Category Archives: Quality
Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading
Jan30
Problem Analysis and Solving: 8D report
The “8D report” is a tool commonly used in the electronics assembly industry for “problem analysis and solving.” Due to its systematic and clear steps, the “8D report” is often utilized in responding to customer complaint cases. The term “8D” … Continue reading
Jan16
RSS or RTS? Which SMT Profile Should You Choose?
Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading
Jan09
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow
The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA … Continue reading