Seach This Blog
Tag Cloud
Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx Discoloration ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PLC Problem analysis & solving Red Dye Penetration Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Quality
Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them
Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading
Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids
Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading
Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement
Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading
Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test
Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading
Aug12
BGA Solder Ball Crack Analysis Using the Red Dye Test | Types and Failure Patterns
Figure: Use the Red Dye Test to Identify BGA Solder Ball Cracks: Failure Patterns and Practical Analysis BGA IC functional failures are a major headache for many electronics companies. This is especially true today, as most CPUs use BGA packages. … Continue reading
