Category Archives: Quality


Apr17
How to Identify Unknown Contaminants: Choosing Between EDX/EDS and FTIR

post on April 17, 2025

When we discover unknown contaminants on printed circuit boards assembly (PCBA) or electronic products, how do we determine what they are and where they come from? Do we rely on experience, or do we use scientific instruments for analysis? What … Continue reading →

EDX/EDS/SEM/IMC/FTIR,, Quality     WorkingBear    Views (735)     comment (0)
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Apr03
PCB Warping and Bowing: Causes, Prevention, and Best Design PracticesPCB warpage

post on April 3, 2025

A user asked: “During the SMT process, PCBs often warp or bow after going through reflow high temperature. In severe cases, this can lead to defects like insufficient solder joints or tombstoning. How can we prevent and solve this issue?” … Continue reading →

PCB/FPC/PTF, Quality, SMT     WorkingBear    Views (221)     comment (0)

Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?

post on March 27, 2025

Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading →

Design, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (507)     comment (0)
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Mar06
What is the Popcorn Effect in PCBs and Electronic Components?

post on March 6, 2025

The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, Reliability     WorkingBear    Views (651)     comment (0)
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Feb20
PCB Popcorn Effect: Why it Happens and How to Stop It

post on February 20, 2025

The main reasons for PCB delamination or “popcorning” are primarily (1) moisture absorption and (2) excessive α2/Z-axis CTE (Coefficient of Thermal Expansion). Among these, moisture absorption is responsible for about 70% of delamination issues. Other factors, such as uneven thermal … Continue reading →

PCB/FPC/PTF, Quality, SMT     WorkingBear    Views (705)     comment (0)
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