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Category Archives: Quality
Sep16
Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause
Figcaption: Component Drop-Off on PCBs: How to Analyze, Troubleshoot, and Identify the Root Cause Components falling off a PCB can be a nightmare for many process and quality engineers. Workingbear has previously shared several cases involving components falling off PCBs. … Continue reading
Sep09
How to Read a BGA Red Dye Penetration Test Report: What the Results Really Mean and How to Interpret Them
Figure 1: How to interpret the deeper meaning of a laboratory BGA red dye penetration test report If I showed you the microscope image above (Figure 1), taken right after a Red Dye Penetration Test, could you tell Workingbear what … Continue reading
Sep02
BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids
Figure: BGA Red Dye Penetration Test: Acceptance Criteria for Cracks and Voids A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At … Continue reading
Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement
Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading
Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test
Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading
