Seach This Blog
Tag Cloud
AOI Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) EDX/EDS/SEM ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Quality
Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading
Nov26
Youtube: 5 Key Mindsets Before You Start Writing an 8D Report
Do you ever find yourself being less than honest when writing an 8D report to a customer? Or maybe in your company, the 8D report is more like a “one-man show”? What should we really pay attention to when writing … Continue reading
Oct08
What Can an SPI (Solder Paste Inspection) Machine Really Do?
SPI stands for Solder Paste Inspection. If we’re talking about the actual inspection equipment, people usually add “machine” after SPI. But in most cases, when you mention SPI in an SMT factory, everyone just assumes you’re talking about the inspection … Continue reading
Sep30
How PCB S/M and Silkscreen Thickness Can Mess with Solder Paste Volume and Even Cause BGA Shorts!
Over the past few days, Workingbear came across an issue I hadn’t really considered before. Here’s the story: an EMS (electronics manufacturing service) factory reported that during SMT production, they were seeing solder shorts under BGA components. After digging into … Continue reading
Aug25
Introduction to Process Capability ─ How to Evaluate and Improve It
In earlier articles, we talked about three statistical indicators for process capability: Cp, Ck, and Cpk. But some people may still feel unclear about what these really mean. Let’s use normal distribution charts to explain them in a simpler way.
