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Category Archives: Quality
Oct08
What Can an SPI (Solder Paste Inspection) Machine Really Do?
SPI stands for Solder Paste Inspection. If we’re talking about the actual inspection equipment, people usually add “machine” after SPI. But in most cases, when you mention SPI in an SMT factory, everyone just assumes you’re talking about the inspection … Continue reading
Sep30
How PCB S/M and Silkscreen Thickness Can Mess with Solder Paste Volume and Even Cause BGA Shorts!
Over the past few days, Workingbear came across an issue I hadn’t really considered before. Here’s the story: an EMS (electronics manufacturing service) factory reported that during SMT production, they were seeing solder shorts under BGA components. After digging into … Continue reading
Aug25
Introduction to Process Capability ─ How to Evaluate and Improve It
In earlier articles, we talked about three statistical indicators for process capability: Cp, Ck, and Cpk. But some people may still feel unclear about what these really mean. Let’s use normal distribution charts to explain them in a simpler way.
Aug07
What’s the Difference Between Electromigration (EM) and Electrochemical Migration (ECM)?
At first glance, Electromigration (EM) and Electrochemical Migration (ECM) might seem alike. In both cases, metal atoms or ions move from a high-voltage area to a low-voltage area, and both can lead to dendrite growth. But they’re actually very different … Continue reading
Aug06
How to Perform Process Capability Analysis?
Process Capability refers to how well a process can produce quality products once it becomes stable. In real production, many variable factors can cause the process to fluctuate. By applying statistical methods, we can better understand how the process is … Continue reading
