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Category Archives: Quality
Sep02
Acceptance Criteria for Red Dye Penetration Test Analysis
A reader asked Workingbear, “After performing a Red Dye Penetration / Red & Pry Test on a BGA, how should we determine the acceptance and rejection criteria?” At first, this question really stumped Workingbear. The Red Dye Penetration Test is … Continue reading
Aug25
[Case Study] BGA Solder Ball Cracking: Strain Gauge Analysis and Design Improvement
Figcaption：BGA soldering crack analysis: Cross-Section shows crack locate at IMC location During new product development, electronics companies may encounter BGA solder ball cracking after a drop test in which the bare unit is dropped from a specified height. When this … Continue reading
Aug19
BGA Solder Ball Crack Analysis: How to Identify the Root Cause Using the Red Dye Penetration Test
Figcaption: How to Identify the True Root Cause of BGA Solder Ball Cracking Using the Red Dye Penetration Test When a BGA fails and the Red Dye Penetration Test reveals cracked solder balls, how can we determine the actual root … Continue reading
Aug12
BGA Solder Ball Crack Analysis Using the Red Dye Test | Types and Failure Patterns
Figure: Use the Red Dye Test to Identify BGA Solder Ball Cracks: Failure Patterns and Practical Analysis BGA IC functional failures are a major headache for many electronics companies. This is especially true today, as most CPUs use BGA packages. … Continue reading
Jul30
How to Analyze Returned Electronic Products and BGA Failures: A Practical Step-by-Step Troubleshooting Guide
Figure: Using the Red Dye Penetration Test to Check BGA Solder Joints for Open Solder or Head-in-Pillow (HIP) Defects At first glance, analyzing returned electronic products or BGA failures doesn’t seem all that complicated. In reality, however, many new engineers … Continue reading
