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Category Archives: Quality
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
Apr17
How to Identify Unknown Contaminants: Choosing Between EDX/EDS and FTIR
When we discover unknown contaminants on printed circuit boards assembly (PCBA) or electronic products, how do we determine what they are and where they come from? Do we rely on experience, or do we use scientific instruments for analysis? What … Continue reading
Apr03
PCB Warping and Bowing: Causes, Prevention, and Best Design PracticesPCB warpage
A user asked: “During the SMT process, PCBs often warp or bow after going through reflow high temperature. In severe cases, this can lead to defects like insufficient solder joints or tombstoning. How can we prevent and solve this issue?” … Continue reading
Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?
Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading
