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Category Archives: Process
Jul04
Exploring EVT/DVT/PVT: Explaining the Three Crucial Validation Stages in New Product Development
When developing a new product, it is common to conduct a “trial run” to obtain a prototype sample. This serves two purposes: firstly, it allows developers to further test and validate the prototype’s functionality, and secondly, it helps the manufacturing … Continue reading
Jun13
How to Determine Whether Underfill is Needed for BGA?
A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading
Jun06
Questions from Newcomer: Why is Solder Paste Needed for SMT Reflow since BGA Already has Solder Balls? Is Solder Paste Needed for BGA Repair?
Questions from a newcomer about electronic manufacturing assembly process: Since there are already solder balls locate on the BGA substrate, why is it necessary to apply solder paste on the PCB pads during SMT reflow? Is it necessary to apply … Continue reading
Jun01
What is Wave Soldering? Laminar Wave and Turbulent Wave Purpose
Before the development of Surface Mount Technology (SMT), almost all printed circuit board assemblies (PCBAs) had to go through the process of wave soldering to achieve the purpose of soldering electronic components to the board. The process of “wave soldering” … Continue reading
May10
How to Bake PCB? Baking Conditions and Methods, Why Expired PCBs Need to Be Baked Before SMT or Reflow Soldering?
For many engineers, they may not understand why PCBs must be baked before going through the SMT reflow oven if they have expired their storage shelf life. Or perhaps, they believe that PCBs should be baked regardless of whether or … Continue reading
