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Category Archives: Process
Aug31
Why is Panelization and Break-away Tab Necessary in PCB Manufacturing, then De-paneling after PCBA is Completed?
Why is “Panelization” performed during PCB manufacturing? And after surface mounting (SMT) assembly and wave soldering, why is it necessary to go through the additional process of “de-paneling” to separate the individual boards? What is the purpose of the PCB’s … Continue reading
Aug17
An Option for Adding More Solder – Solder Preforms
“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading
Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?
WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading
Jul04
Exploring EVT/DVT/PVT: Explaining the Three Crucial Validation Stages in New Product Development
When developing a new product, it is common to conduct a “trial run” to obtain a prototype sample. This serves two purposes: firstly, it allows developers to further test and validate the prototype’s functionality, and secondly, it helps the manufacturing … Continue reading
Jun13
How to Determine Whether Underfill is Needed for BGA?
A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading
