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Category Archives: Process
Apr02
Can Surface Mount Devices Run Through the Wave Soldering Without Falling Into the Pot?
In previous discussions, Workingbear introduced the “wave soldering” process, which was used in early day of PCBA soldering. SMT assembly, on the other hand, emerged later. Can wave soldering be used for Surface Mount Devices (SMDs) after SMT placement? Workingbear … Continue reading
Mar26
What is AOI? What Defects Can 2D AOI Detect in PCB Assembly?
AOI (Auto Optical Inspection) is an automated optical recognition system that has become widely used in the electronics industry for inspecting the quality of soldering, component placement accuracy and the presence of missing components on PCBA (Printed Circuit Board Assembly) … Continue reading
Mar12
Why Do PCBs Have Those Small Circles? What purpose of Test Points on PCBs?
Have you ever noticed those tiny circles on PCBs and wondered why they’re there? They don’t seem to have any parts soldered onto them, and some don’t even have solder paste. Well, those small circles are called test points, and … Continue reading
Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?
In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading
Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading
