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Category Archives: Process
Mar26
What is AOI? What Defects Can 2D AOI Detect in PCB Assembly?
AOI (Auto Optical Inspection) is an automated optical recognition system that has become widely used in the electronics industry for inspecting the quality of soldering, component placement accuracy and the presence of missing components on PCBA (Printed Circuit Board Assembly) … Continue reading
Mar12
Why Do PCBs Have Those Small Circles? What purpose of Test Points on PCBs?
Have you ever noticed those tiny circles on PCBs and wondered why they’re there? They don’t seem to have any parts soldered onto them, and some don’t even have solder paste. Well, those small circles are called test points, and … Continue reading
Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?
In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading
Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading
Jan16
RSS or RTS? Which SMT Profile Should You Choose?
Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading
