Category Archives: PCB/FPC/PTF


Mar15
Why BGA soldering ball always crack(9)? Increase the resistance of components to stress

post on March 15, 2023

How to increasing the ability of components to resist stress?(Continuing from the previous article) 2. No solder balls on BGA four corners, or use dummy balls instead of them. If you had studied the actual phenomenon of BGA solder cacking … Continue reading →

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (1,689)     comment (0)
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Mar10
Why BGA soldering ball always crack(8)? Increase PCB stiffness to resist stress and avoid board bending

post on March 10, 2023

In the previous article, WorkingBear talked about how to improve the adhesion of PCA to resist the impact of stress. Today, We will move on to another topic: “How to increase the ability of components or circuit boards to resist … Continue reading →

Design, PCB/FPC/PTF, SMT     WorkingBear    Views (2,134)     comment (0)
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Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

post on June 19, 2017

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading →

Design, Manufacture, PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (6,287)     comment (0)
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Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength

post on October 1, 2015

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading →

PCB/FPC/PTF, Reliability, SMT, Soldering     WorkingBear    Views (22,433)     comment (0)
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Jul01
Why do thinner PCBs will need carrier for reflow process?

post on July 1, 2015

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading →

Design, Glue/adhesive/epoxy/underfill,, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (13,786)     comments (2)
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