Category Archives: PCB/FPC/PTF


Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials

post on April 28, 2023

The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has … Continue reading →

Design, PCB/FPC/PTF     WorkingBear    Views (1,692)     comment (0)
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Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources

post on April 11, 2023

Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading →

Design, PCB/FPC/PTF, Quality, SMT, Soldering     WorkingBear    Views (3,089)     comments (3)
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Apr06
Why BGA soldering ball always crack(12)? Manufacturing Processes That May Generate Significant Stress

post on April 6, 2023

Manufacturing processes that may result in high stress in factories Inevitably, there are many opportunities to handle and operate PCBs in the manufacturing process of factories, which means there is a chance to apply “stress” to the boards.

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (1,796)     comment (0)
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Mar29
Why BGA soldering ball always crack(11)? Stress is the Biggest Culprit in Causing BGA Solder Joint Cracks

post on March 29, 2023

The earlier sections of the article that Workingbear spent a lot of time discussing how to strengthen the bonding force of PCBAs and increase the stress resistance of electronic products. Now, we can finally talk about the biggest culprit causing … Continue reading →

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (2,370)     comment (0)
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Mar21
Why BGA soldering ball always crack(10)? Reduce the impact of PCB bending through the mechanism design change

post on March 21, 2023

Reducing the Impact of Stress on PCB Deformation through Mechanism Design In earlier sections, WorkingBear briefly mentioned the possible solution by  changing mechanism design to address the problem of solder cracking. One such approach involves replacing the SMDs (surface mount … Continue reading →

Design, PCB/FPC/PTF, SMT, Soldering     WorkingBear    Views (1,808)     comment (0)
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