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Category Archives: PCB/FPC/PTF
Aug31
Why is Panelization and Break-away Tab Necessary in PCB Manufacturing, then De-paneling after PCBA is Completed?
Why is “Panelization” performed during PCB manufacturing? And after surface mounting (SMT) assembly and wave soldering, why is it necessary to go through the additional process of “de-paneling” to separate the individual boards? What is the purpose of the PCB’s … Continue reading
Aug01
What is OSP (Organic Solderability Preservative) Surface Treatment for PCB? What are its Pros and Cons?
OSP (Organic Solderability Preservative) is a special chemical coating applied to the surface of copper on a PCB (Printed Circuit Board). This coating forms a thin protective film that keeps the bare copper from rusting or corroding when it’s stored. … Continue reading
Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?
WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading
Jul18
Why are there holes on the PCB? What is PTH, NPTH and vias?
If you ever get the chance to hold a printed circuit board (PCB) in your hands and take a closer look, you’ll notice there are many different-sized holes. When you hold it up to the light, you’ll even see lots … Continue reading
Jul13
What is blind hole, buried hole and plating hole for PCB?
In the early response to a user’s question, WorkingBear mistakenly mixed up the terms “blind hole” and “buried hole” when talking about PCBs. To prevent similar errors in the future, WorkingBear took the initiative to study some books about PCBs … Continue reading
