Category Archives: PCB/FPC/PTF


Jul01
Why do thinner PCBs will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading

Apr22
HotBar FPC Design Notices

The HotBar soldering is a kind of selective soldering solution where connect two pre-fluxed, solder coated parts by pulse heating element, call a “thermode”, with proper temperature to melt the solder and re-solder. Applying a pressure and contacting on the … Continue reading

Apr21
Design Guideline for Flex cable(FPC) Trace Pattern

Many FPCB designers may not be well-versed in the manufacturing process and its limitations. Workingbear have often come across designs that don’t meet DFx requirements, where designers insist on their approach, leading to numerous quality issues during mass production. In … Continue reading

Apr20
Screen-Printing on PET(PolyEthylene Terephthalate) notices

The PTF uses silk-screen to print the silver and carbon combination conductive inks on PET substitute to reach lower cost purpose as compare with FPC (Flexible Printing Circuit). Unfortunately, the screen-printing still has some ability limits. Especially that it has … Continue reading

Apr20
What is PTF(Polymer Tick Film)? PTF introduction

Polymer Thick Film (PTF) flexible circuits are manufactured by screen-printing conductive ink onto flexible substrates such as PET (Polyethylene terephthalate). It can be single layer or multi-layers circuit by further screen-printing dielectric materials as insulating layer and applying through-hole technologies. … Continue reading