Category Archives: PCB/FPC/PTF


Jun19
Increase solder paste volume will improve the MLCC capacitor broken?

Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor)  component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading

Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength

Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading

Jul01
Why do thinner PCBs will need carrier for reflow process?

As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want  thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want  strong, robust, sturdy assemblies that … Continue reading

Apr22
HotBar FPC Design Notices

The HotBar soldering is a kind of selective soldering solution where connect two pre-fluxed, solder coated parts by pulse heating element, call a “thermode”, with proper temperature to melt the solder and re-solder. Applying a pressure and contacting on the … Continue reading

Apr21
Design Guideline for Flex cable(FPC) Trace Pattern

Many FPCB designers may not be well-versed in the manufacturing process and its limitations. Workingbear have often come across designs that don’t meet DFx requirements, where designers insist on their approach, leading to numerous quality issues during mass production. In … Continue reading