Category Archives: Manufacture


May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading

May20
Shipping carton drop/impact test condition

Do you know how vendor ensure that their products are not damaged during shipping due to handling by transporters or delivery personnel? Reputable vendors put effort into designing and selecting suitable packaging materials for shipping to ensure the quality of … Continue reading

May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?

We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading

May01
Why Do Screw Bosses Crack After Mold-In Screw Inserts? Common Causes and Solutions

This story is long-standing memory, but WorkingBear is documenting it here for reference and as a learning record. One day, we received a customer complaint regarding a product with a plastic housing that had cracked. The issue was visually striking, … Continue reading

Apr29
How to design LCM gasket/cushion for manufacture?

The LCM (LCD Module) is a common component for the electronic products. Almost of the LCM was made by glass and it is brittle and  break easily while hit or drop on the floor due to handle careless. As product … Continue reading