Category Archives: Manufacture

Page 2 of 41234

Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution

Today, the SMD parts become smaller and smaller. Their sizes can be developed to 0402, 0201, and even 01005 (Note 1). Moreover, the pitch between the pins of a common IC (integrated circuit) is shorten to fine pitch of 0.5mm, … Continue reading

Jun17
Selectively increase solder paste volume solutions

Why need to partially increase the solder paste volume? This is in order to meet current smaller and thinner electric component design, the stencil thickness is made as thin as possible to accurately control the tiny solder paste which print … Continue reading

Jun10
PCB rework: Selective solder mask removal by laser

Did you ever met a trouble need to rework to remove the solder mask from the PCB?  If yes then how you did? We usually remove the solder mask manually  by knife or hand grinding tool. But these kinds of … Continue reading

Jun03
TQRDCE Performance Expectations and Review

This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The strategy of company for establishing and maintaining long-term working relationships is through creating and monitoring mutual performance expect ions and measurements. Performance metrics, constructive feedback, as … Continue reading

May27
Improve BGA solderability by partial increase solder paste volume

How to improve the BGA (Ball Grid Array) package solderability is always a big challenge for SMT (Surface Mount Technology) process. Especially for the fine pitch (ball pitch less than 0.8mm) BGA is more difficult to be soldered on the … Continue reading

Page 2 of 41234