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Category Archives: Design
May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading
Mar27
Does PCB Solder Mask Misalignment Lead to BGA Soldering Defects?
Recently, our company started a new project, and the R&D team has been pushing PCB layout requirements to the extreme. As PCBs size get smaller, the solder mask (S/M) design must also shrink accordingly. However, our current PCB manufacturers struggle … Continue reading
Feb27
What Is Solder Mask (S/M)? What Is Its Purpose on a PCB? Why Is It Usually Green?
In discussions about printed circuit boards (PCBs), you’ll often hear the term Solder Mask (S/M). But what exactly is a solder mask, and what role does it play in a PCB? Some also refer to it as solder resist. What … Continue reading
Dec12
Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement
In the realm of PCB assembly, the go-to technology in SMT (Surface Mount Technology) is what we call “Full Board Reflow Soldering.” While there are other methods for assembling PCBs, this “Full Board Reflow Soldering” can be divided into two … Continue reading
Dec05
How Preventing Heavy Components from Falling during Secondary time SMT Reflow
With the rapid advancement of mobile communication technology, EMS (Electronic Manufacturing Services) providers worldwide are facing severe labor shortages. Furthermore, the Industry 4.0 trend has heightened the demand for automation in EMS facilities. As a result, many components that were … Continue reading
