Author Archives: WorkingBear


Jun05
Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing

post on June 5, 2025

From what I remember, one of the earliest and most frequent requests for tumble testing came from Motorola. Since some of Motorola’s mobile phones and products were designed for military use, their reliability and quality standards were exceptionally strict. However, … Continue reading →

Design, Process, Quality, Reliability     WorkingBear    Views (1,133)     comment (0)

May29
Uncovering the Culprit: How CAF Turned Out to Be the Hidden Cause Behind PCB Micro-Shorts — From Suspicion and Analysis to Solutions

post on May 29, 2025

Workingbear’s company was having a tough time with a strange issue: intermittent micro-short circuits inside the layers of the PCB. Since the shorts didn’t show up near any components, it was really hard to figure out what was wrong. Recently, … Continue reading →

Case study, EDX/EDS/SEM/IMC/FTIR, PCB/FPC/PTF, Process, Quality, Reliability     WorkingBear    Views (1,451)     comment (0)
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May22
What is CAF (Conductive Anodic Filament) in PCBs? and How to Prevent It

post on May 22, 2025

One of our company’s products once experienced an issue called an “internal micro-short” in the printed circuit board (PCB). After investigation, we discovered the root cause was something called CAF (Conductive Anodic Filament). But let’s be honest—if you translate that … Continue reading →

PCB/FPC/PTF, Quality, Reliability, SMT, Soldering     WorkingBear    Views (1,502)     comment (0)
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May15
The Role of Process Engineers and Product Engineers in a Company

post on May 15, 2025

Many people, especially newcomers to the workforce, may feel confused when they first hear the term Process Engineer. What exactly does a process engineer do? First, let’s understand what process means. Simply put, a process refers to the manufacturing procedure—the … Continue reading →

Manufacture, Role & Responsibility     WorkingBear    Views (1,274)     comment (0)

May08
The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)

post on May 8, 2025

Hey folks, welcome back to the blog! Today, we’re diving deep into something absolutely critical for the reliability of almost every electronic gadget out there: BGA solder joints. You know, those tiny connections that hold complex chips onto our printed … Continue reading →

Design, PCB/FPC/PTF, Process, Quality, Reliability, SMT     WorkingBear    Views (1,769)     comments (1)
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