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Author Archives: WorkingBear
May14
Temperature Environmental Cycle Profile
The purpose of temperature environmental test is that the good are shipped by various types of carriers and experience a wide range of storage temperatures, depending on the customer environment, hence the need for this kind of testing. Further, certain … Continue reading
May12
Humidity Temperature Cycle Profile
The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in … Continue reading
May05
Why Burn/In(B/I) still cannot screen out the DDR soldering fail?
We recently encountered a soldering issue with a DDR memory BGA (Ball Grid Array). The problem identified was HIP (Head-In-Pillow) — two balls with non-wetting under the BGA package were affected. To investigate, we sent someone to the field to … Continue reading
May01
Why Do Screw Bosses Crack After Mold-In Screw Inserts? Common Causes and Solutions
This story is long-standing memory, but WorkingBear is documenting it here for reference and as a learning record. One day, we received a customer complaint regarding a product with a plastic housing that had cracked. The issue was visually striking, … Continue reading
Apr29
How to design LCM gasket/cushion for manufacture?
The LCM (LCD Module) is a common component for the electronic products. Almost of the LCM was made by glass and it is brittle and break easily while hit or drop on the floor due to handle careless. As product … Continue reading
