Author Archives: WorkingBear


Jun17
Selectively/partial increase solder paste volume solutions

Why is it necessary to partially increase the solder paste volume in SMT soldering? To meet the demands of smaller and thinner electronic component designs, stencils are made as thin as possible to precisely control the tiny solder paste printed … Continue reading

Jun10
PCB rework: Selective solder mask removal by laser

As an engineer in the electronics manufacturing industry, have you ever encountered the need to rework a printed circuit board (PCB) to remove the solder mask? If so, how did you approach this problem? Traditionally, the solder mask is manually … Continue reading

Jun03
TQRDCE Performance Expectations and Review

This is an example that implement TRQDCE form for vendor survey. TQRDCE Introduction: The company’s approach to establishing and maintaining long-term working relationships involves creating and monitoring mutual performance expectations and measurements. The use of performance metrics, constructive feedback, and … Continue reading

May27
Improve BGA Solderability By Partially Increasing Solder Paste Volume

Improving the solderability of BGA (Ball Grid Array) packages is always a big challenge for the SMT (Surface Mount Technology) process. Fine pitch BGAs (with a ball pitch less than 0.8mm) are particularly difficult to solder onto the PCB. Additionally, … Continue reading

May20
Shipping carton drop/impact test condition

Do you know how vendor ensure that their products are not damaged during shipping due to handling by transporters or delivery personnel? Reputable vendors put effort into designing and selecting suitable packaging materials for shipping to ensure the quality of … Continue reading