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Author Archives: WorkingBear
Jan04
What is Step-up & Step-down Stencil? Selective Solder Paste Volume Increasing Solution
The trend in the electronics industry is toward smaller and smaller SMD components, with sizes such as 0402, 0201, and even 01005 becoming common (Note 1). Additionally, the pitch between pins on ICs has decreased to a fine pitch of … Continue reading
Oct01
Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength
Since the electronic product design moves from desktop to portable devices, the manufacturer also make electronic component as small as possible to meet this popular trend. Besides, the PCB thickness also become thinner and the associated soldering pads on the … Continue reading
Jul01
Why do thinner PCBs will need carrier for reflow process?
As the career of Manufacturing Process Engineering(MPE), WorkingBear has noticed a constant battle between Designers, Marketers, and Manufacturers. Marketers always want thin, modern design that look thin. Designers think fabrication is simple, while Manufacturers want strong, robust, sturdy assemblies that … Continue reading
Jun24
Case study for the mold-in insert screw boss broken
In a previous discussion, WorkingBear identified potential root causes for screw boss cracking after mold-in screw nut insertion. Following a complaint from the field, we asked EMS and the plastic injection supplier to double-check their inventory and found that approximately … Continue reading
Jun17
Selectively/partial increase solder paste volume solutions
Why is it necessary to partially increase the solder paste volume in SMT soldering? To meet the demands of smaller and thinner electronic component designs, stencils are made as thin as possible to precisely control the tiny solder paste printed … Continue reading
