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Author Archives: WorkingBear
Nov13
Why BGA soldering ball always crack(3)? IMC layer growth is a certain result to form the soldering joints
The Intermetallic Compound (IMC) layer grows in the interface between Cu-based, Ni-based and Sn-solder is the certain result of the chemical reaction that forming the soldering joint. But the IMC layer is also the weakest location of the solder bonding-force. … Continue reading
Oct30
Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
This article will talk about the composition of the PCBA bonding-force. There are numerous factors and elements involved in PCBA bonding force. However, Workingbear believes that we can utilize the findings of the red dye test to examine this issue. … Continue reading
Sep25
Why BGA soldering ball always crack(1)? Stress > bonding-force
What is the actual root cause of BGA solder ball cracking? Stress is higher than its bonding-forces. The root cause of BGA solder ball cracked is stress higher than bonding-forces. Stress is higher than bonding-force is the certain result of … Continue reading
Dec19
What is IMC (Intermetallic Compound) in the electronic manufacturing industry？
What is the IMC, the Intermetallic Compound? We always heard the manufacturing engineer or some of Mechanical Engineer talking about this keyword when discussing soldering quality or electronic component drop issue. So, what is the role of IMC layer in … Continue reading
Dec05
Both solder joint bridging and open solder joint happen at same BGA?
Is that possible for both solder joint bridging and open solder joint defect occur in the same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is rare to observe both solder joint bridging and open solder joint … Continue reading
