Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept DFx ECM (Electrochemical migration) EDX/EDS/SEM ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Red Dye Penetration Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR,
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Author Archives: WorkingBear
May10
How to Bake PCB? Baking Conditions and Methods, Why Expired PCBs Need to Be Baked Before SMT or Reflow Soldering?
For many engineers, they may not understand why PCBs must be baked before going through the SMT reflow oven if they have expired their storage shelf life. Or perhaps, they believe that PCBs should be baked regardless of whether or … Continue reading
May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs
Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the advantages and disadvantages for them? What are the design recommendations for them? … Continue reading
Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials
The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has … Continue reading
Apr25
Four Solutions for Quickly Removing labels from Carton and Devices
At Workbearing’s electronic manufacturing service (EMS) factory and warehouse, products often need to be reworked for various reasons, such as customer requests or converting products for inventory purposes. While removing labels is not the most crucial task in the rework … Continue reading
Apr21
Understanding Moisture Sensitive Devices: A Guide for Manufacturers
Moisture Sensitive Devices (MSD) refer to electronic components that are sensitive to moisture. Moisture, also known as humidity, refers to the amount of water vapor in the atmosphere that the components are exposed to. The environment is typically the factory … Continue reading
