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Author Archives: WorkingBear
May18
Clarifying the Concept of Electronic Component Soldering Strength
While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading
May16
What is the difference between PCB and PCBA? PCB is like land with roads, but it doesn’t have buildings yet
What is the difference between PCB and PCBA? This is actually something that should be easily understood, but since someone asked, Workingbear will try explain it briefly here. If any readers notice any errors, please feel free to correct me. … Continue reading
May10
How to Bake PCB? Baking Conditions and Methods, Why Expired PCBs Need to Be Baked Before SMT or Reflow Soldering?
For many engineers, they may not understand why PCBs must be baked before going through the SMT reflow oven if they have expired their storage shelf life. Or perhaps, they believe that PCBs should be baked regardless of whether or … Continue reading
May02
Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs
Do you know what are the SMD (Solder Mask Defined) and NSMD (Non-Solder Mask Defined) land pattern pads? Any difference between SMD and NSMD pads? What are the advantages and disadvantages for them? What are the design recommendations for them? … Continue reading
Apr28
Introduction to the structure, characteristics and precautions of Printed Circuit Board materials
The PCB substrate is composed of layers of Copper Clad Laminate (CCL) and Prepreg (PP). CCL consists of three main components: Copper Foil, Reinforcement, and Resin Matrix. Since the start of lead-free manufacturing processes, the fourth item of Fillers has … Continue reading
