During the design and verification phase of electronic products, an Impact Drop Test is a standard procedure. This test is generally divided into two phases:

1. Product Drop Test – Testing the device without packaging.
2. Packagage Drop Test – Evaluating the protective capability of the packaging during transportation.

(Note: This article is based on personal experience and is for reference only. If you have different opinions, feel free to discuss with us. Also, the test methods mentioned are not industry standards, so please use discretion when referring to them.)

Another impact-related test is the Tumble Test, which evaluates the durability of products subjected to repeated drops. If you’re interested, you can check out another article: “Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing “

Package Drop Test

This test typically applies to corrugated cardboard packaging and is designed to simulate real-world shipping conditions. The goal is to ensure that the product remains functionally intact, structurally stable, and aesthetically undamaged despite multiple handling events, accidental drops, and transportation vibrations.

Product Drop Test

The product drop test simulates scenarios where end users accidentally drop the device onto the ground. While most product manuals state that accidental drops are considered customer misuse and not covered under warranty, a well-designed product shouldn’t fail instantly upon a single drop. If a competitor’s product can survive drops while yours breaks easily, it will undoubtedly lose market competitiveness.

However, it is important to note that product drop tests are not intended to ensure the exterior remains scratch-free. Instead, the test evaluates whether the product’s functionality and internal/external structure remain intact after impact.

Please note that the product drop test conditions mentioned here are not based on any international standard. Our company started performing these tests before such standards existed, and we’ve continued using the same method ever since. At the time, we referred to HP’s internal specifications.

As I know, the following international standards currently apply to product unit drop testing (please verify, as they may not be completely accurate):

• IEC 60068-2-31, Test Ec: Rough handling shocks, primarily for equipment-type samples specimens

• IEC 60068-2-32, Test Ed: Free fall

Drop Height Considerations

Drop height depends on the intended use case of the product:

• Devices meant for tabletop use (e.g., desktop accessories) are typically tested at 76 cm (~30 inches).
• Handheld devices such as ordering terminals or inventory scanners, usually carried at waist or chest level, are tested at 90 cm (~35 inches) or 120 cm (~47 inches).
• Mobile phones or head-mounted devices require higher drop tests, typically around 150 cm (~59 inches) or even 180 cm (~71 inches).

Drop Surface Materials

The impact surface must also be well-defined. Common test surfaces include:

• Concrete
• Metal plates (Steel)
• Solid wood
• Carpet

The harder the impact surface, the higher the severity of the test. These definitions are based on real-world usage scenarios and help evaluate durability under different conditions.

Testing with Fully Assembled Units

Drop tests must be conducted on fully assembled, production-ready units, including necessary accessories such as batteries. Even if a single unit costs thousands of dollars, multiple units (typically at least five per test) must be dropped. Yes, this is costly! But without it, there’s no way to confirm whether the product can withstand real-world impacts or to identify potential failure points.

Common Drop Test Failures

Some of the most frequently observed failures include:

• Cracked display panels
• Broken screw posts
• Electronic components detaching from the PCB

For handheld devices, one of the most common issues is failure to power on, often due to BGA solder joint fractures.

Can Software Simulations Replace Physical Drop Tests?

It is possible to use simulation software to identify weak points in a design, helping engineers reinforce those areas. However, each product has unique characteristics, and fully replacing physical drop tests with simulations requires extensive data input, including:

• Component dimensions
• Mass and material properties
• Elasticity and impact resistance
• Assembly strength between parts

Simply gathering and modeling this data is already a significant challenge. So far, Workingbear has yet to see any simulation software that can 100% replace real-world drop testing.

Standardized Drop Orientations and Testing Sequence

When performing a drop test, the ideal scenario would be to drop the product randomly. However, since this is a controlled test, there must be a standardized procedure. This is why we define six faces, four edges, and sometimes eight corners for testing (refer to the image above).

Drop Test Orientations

• Six Faces (Face Drop):

  • Bottom
  • Top
  • Right
  • Front
  • Left
  • Rear

• Four Edges (Edge Drop):

  • Right-Rear Edge (R-R Edge)
  • Front-Right Edge (F-R Edge)
  • Front-Left Edge (F-L Edge)
  • Right-Left Edge (R-L Edge)

In an ideal case, the drop order should be randomized. However, since we don’t have an unlimited supply of test units—and our boss probably wouldn’t be too happy about it—we typically follow a preset sequence:

Bottom → Top → Right → Front → Left → Rear → R-R Edge → F-R Edge → F-L Edge → R-L Edge

To distribute the impact across different units, the first product starts with the Bottom face, the second product starts with the Right face, and so on, ensuring all faces and edges get tested systematically.

Testing Procedure

For handheld devices, the drop test is performed with the product powered on. After each drop, we check:

• Functionality
• Exterior condition
• Any abnormal sounds when shaking the device (to identify loose internal components)

All issues are documented. Once the drop test is fully completed, the product is disassembled to inspect its internal structure.

During the test, if an issue is detected, it must be recorded. Some problems can be fixed on the spot to continue testing:

• If an accessory detaches, reattach it and proceed.
• If the software crashes, restart the device and continue.
• If the issue cannot be fixed, record the failure and stop testing for that unit.

Pass/Fail Criteria

The decision on whether a failure is acceptable or critical depends entirely on company policy. Some failures might be tolerable depending on the business strategy, product launch schedule, or cost constraints. However, if improvements are required, they could delay the product launch or increase development costs.

Ultimately, determining which failures to address is more than just an engineering decision—it’s a business decision as well.

Related Posts:

• Humidity Temperature Cycle Profile
• Temperature Environmental Cycle Profile
• Shipping carton drop/impact test condition
• Tumble Test: How to Prevent PCB and BGA Failures in Electronics Manufacturing