I am a Manufacturing Process Engineer (MPE)
Working for manufacturer engineering couple years. Sharing the manufacturing experience, skill, DFx, design, and information. Be care of this blog is personal share and content may not be 100% correctly.
Email RSS訂閱
Skip to content
  • Home
  • PCB Assembly
  • Plastic & Injection Molding
  • WorkingBear

Tag Archives: HIP(Head-In-Pillow)

Page 2 of 3«123»

Subject Title Views Comments
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In? Views (1,503) (0)
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls Views (2,607) (0)
RSS or RTS? Which SMT Profile Should You Choose? Views (5,852) (0)
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow Views (2,919) (0)
SMT Reflow Soldering Temperature Profiles Explanation and Precautions Views (12,836) (0)
Page 2 of 3«123»
  • Welcome join the Facebook Group and discussion the SMT knowledge

  • Seach This Blog

  • Tag Cloud

    AOI Baking BGA Burn/In(B/I) Carrier Component drop/detachment Concept DFx EDX/EDS/SEM ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) HotBar ICT IMC LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Red Dye Penetration Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-ray
  • Sponsor

  • Categories

    • Connector
    • Corrugated Paper
    • Design
    • EDX/EDS/SEM/IMC/FTIR,
    • Fundamental Science
    • Glue/adhesive/epoxy/underfill,
    • Keypad
    • Management
    • Manufacture
    • Moisture Sensitive
    • PCB/FPC/PTF
    • Personal Opinion
    • Plastic
    • Process
    • Product Introduction
    • Quality
    • Reliability
    • Role & Responsibility
    • SMT
    • Soldering
    • Test/Inspection
    • Uncategorized
  • Bookmarks

    • 電子製造,工作狂人(ResearchMFG)
  • Histats

  • Statcounter

  • Email Subscription

    FeedBurner
  • Popular Articles

    • [37,667] What is IMC (Intermetallic Compound) in the e...
    • [24,503] PCB Assembly
    • [22,585] Copper Defined vs. Solder Mask Defined pad de...
    • [21,233] TQRDCE Performance Expectations and Review
    • [19,244] Why Do Screw Bosses Crack After Mold-In Screw...
    • [15,343] What is Step-up & Step-down Stencil? Selectiv...
    • [15,118] Why BGA soldering ball always crack(3)? IMC l...
    • [13,881] Why do thinner PCBs will need carrier for ref...
    • [12,836] SMT Reflow Soldering Temperature Profiles Exp...
    • [12,686] Case study for the mold-in insert screw boss ...
  • Recent Posts

    • The Role of Process Engineers and Product Engineers in a Company
    • The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
    • Understanding the EDX Report: Can EDX Be Used to Estimate a Sample’s Chemical Formula?
    • Understanding the EDX Report: Why Does the Same Element Have Multiple Peaks?
    • How to Identify Unknown Contaminants: Choosing Between EDX/EDS and FTIR
  • Recent Comments

    • Enrico on The Deep Dive: BGA Pads: SMD vs. NSMD (Strength, Voids & Design Considerations)
    • WorkingBear on Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
    • boris on Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
    • Jason Wong on What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?
    • WorkingBear on What is IMC (Intermetallic Compound) in the electronic manufacturing industry?
    • WorkingBear on What is IMC (Intermetallic Compound) in the electronic manufacturing industry?
    • Hugo Cardenas on What is IMC (Intermetallic Compound) in the electronic manufacturing industry?
    • Johnson on Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources
    • WorkingBear on Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
    • Stephen Lim on Why BGA soldering ball always crack(2)? The composition of PCBA bonding-force
  • Sponsor

  • Outbound link test

    Check out researchmfg.com
    Check out blogfuntw.com
I am a Manufacturing Process Engineer (MPE)
Proudly powered by WordPress.