ENIG (Electroless Nickel Immersion Gold), also known as immersion gold (Au), chemical Ni/Au, or soft gold, is a type of surface finished for printed circuit boards (PCBs). It is widely used in the assembly of mobile phone circuit boards and some BGA package substrates may also use ENIG or NEPIG (Chemical Nickel Palladium Gold).
ENIG is easy to recognize by appearance. If you see a printed circuit board with gold-colored pads (as shown in the image at the beginning of the article), it is likely ENIG. There is another type of “electroplated nickel gold” PCB that also has gold-colored pads, but due to the high cost of gold, it is rarely used unless there is a special need for a thicker gold layer or hard gold.