The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA (Ball Grid Array) components. Personally, Workingbear think it looks more like a neck or waist, but I believe calling it the “Ball and Socket” or “Double Balls” Phenomenon seems more appropriate.
The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some technical aspects and temperature settings related to reflow soldering.
The reflow profile for printed circuit board assembly generally consists of four major phases: Pre-heat, Soak, Reflow, and Cooling. This article represents a compilation of personal insights, and any corrections or suggestions are warmly welcomed.
The Workingbear is used to seeing job cuts happen in global companies, especially those from the United States, whether they’re big or small. Normal downsizing is like the body’s “metabolism” – not necessarily a bad thing. Companies hire when there’s a lot of work, and they let people go when business isn’t doing well. It’s a routine occurrence. Even though I’ve grown accustomed to it, there’s always a touch of sadness when layoffs happen, especially when coworkers I’ve spent time with suddenly vanish from the company because they’ve been laid off.
“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as electronic components continue to shrink in size.
Solder paste is a crucial material in the domain of modern electronic assembly technology. It is used for soldering electronic components onto printed circuit boards (PCBs), this enabling the creation of ever-evolving technological products.
The invention of solder paste played a pivotal role in the miniaturization of electronic product assembly technology. It transformed bulky devices, such as early large sized mobile phones, into pocket-sized, feature-rich smartphones.
The term “paste” in solder paste is used because its pre-melted form is similar in consistency to the toothpaste we use daily. Before soldering, the paste-like solder can be applied to hold electronic components in place on the surface of the PCB. This ensures that these components remain in position, even under slight vibrations. Its primary function, however, is to solder electronic components onto the PCB, facilitating the connectivity of electronic signals.
