Mar12
Why Do PCBs Have Those Small Circles? What purpose of Test Points on PCBs?

post on March 12, 2024

Why Do PCBs Have Those Small Circles? What purpose of Test Points on PCBs?

Have you ever noticed those tiny circles on PCBs and wondered why they’re there? They don’t seem to have any parts soldered onto them, and some don’t even have solder paste. Well, those small circles are called test points, and they play a crucial role in ensuring that the electronics on the PCB are working correctly during the assembly process.

For those who know about electronics, having test points on a PCB is common knowledge. However, for those with a background in mechanics or other fields, the term “test point” might be a bit confusing.

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PCB/FPC/PTF, Process, Test/Inspection     WorkingBear    Views (2,539)     comment (0)

Mar05
What are ICT(In-Circuit Test) and MDA(Manufacturing Defect Analyzer) in Electronics Manufacturing? Any Benefits?

post on March 5, 2024

What are ICT (In-Circuit Test) and MDA(Manufacturing Defects Analyzer) in Electronics Manufacturing? Any Benefits to Implementing Them?

Do you know what ICT (In-Circuit Test) is? Please note that we are not talking about Information and Communication Technology (ICT) here. And what about MDA (Manufacturing Defect Analyzer)? If these tests are commonly implemented in PCB assembly manufacturing, what are their pros and cons? How do they differ from ATE (Automated Test Equipment)?

ICT is primarily used for the electrical testing of Printed Circuit Board Assemblies (PCBA). Think of it as an advanced “multimeter” or an LCR meter. It allows us to test the electrical characteristics and check for open/short circuits of all components on the circuit board without removing them.

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Test/Inspection     WorkingBear    Views (5,000)     comment (0)
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Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?

post on February 27, 2024

What is Graping Solder Defect in SMT Assembly? How to Fix it?

In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders gather and stack together, resembling a cluster of grapes.

So, how does this “Graping” solder defect happen? Solder paste is essentially a mixture of tiny solder powders combined with flux. When the flux in the solder paste evaporates, it leaves behind individual solder powders.

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Process, Quality, SMT, Soldering     WorkingBear    Views (5,353)     comment (0)
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Feb20
What is IMC (Intermetallic Compound)? How does IMC relate to PCB solder joint strength? Are there IPC standards for IMC thickness?

post on February 20, 2024

What is IMC (Intermetallic Compound)? How does IMC relate to PCB solder joint strength? Are there IPC standards for IMC thickness?

In the assembly and soldering process of printed circuit boards (PCBs), we often hear engineers or lab reports mentioning the term “IMC.” But what exactly is IMC? What role does IMC play in the PCB assembly (PCBA) soldering process? Does it impact solder joint strength? People often comment on IMC being too thin or too thick, so what is a reasonable thickness for IMC?

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Soldering     WorkingBear    Views (9,708)     comment (0)
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Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions

post on February 15, 2024

NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions

Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of BGA packaged ICs. The root cause often lies in the substrate or PCB of the BGA, where the board material may deform due to the high temperatures during the reflow process.

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Process, Quality, SMT, Soldering     WorkingBear    Views (3,239)     comment (0)
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