Feb06
Purpose of Using Lead-Free Low-Temperature Solder (LTS) SnBi, SnBiAg in Soldering

post on February 6, 2024

Purpose of Using Lead-Free Low-Temperature Solder SnBi, SnBiAg in Soldering. Tin-Bismuth alloy solder paste

The alloy composition of lead-free LTS (Low Temperature Solder) usually includes the metal “bismuth (Bi)” in addition to tin (Sn) to lower its eutectic point.

The commonly used lead-free solder SAC305 has a melting point of 217°C, while Sn64Bi35Ag1 has a melting point of only 178°C, and Sn42Bi58 has an even lower melting point of 138°C. This means that the melting temperature of solder containing “bismuth (Bi)” is significantly lower, ranging from 39°C to 79°C lower than SAC305 lead-free solder.

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Quality, Reliability, SMT, Soldering     WorkingBear    Views (1,748)     comment (0)
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Jan30
Problem Analysis and Solving: 8D report

post on January 30, 2024

Problem Analysis and Solving: 8D report

The “8D report” is a tool commonly used in the electronics assembly industry for “problem analysis and solving.” Due to its systematic and clear steps, the “8D report” is often utilized in responding to customer complaint cases.

The term “8D” refers to the “8 Disciplines process.” The person filling out the report generally follows predefined steps in sequence. This helps most quality control personnel systematically identify the causes of problems step by step. It also allows you to explain to the customer how the problem was discovered or occurred, how you analyzed the problem, found the root cause, verified if the problem was genuinely resolved, and implemented preventive measures to prevent the problem from recurring.

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Management, Quality     WorkingBear    Views (3,642)     comment (0)
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Jan23
Why a BOM (Bill of Materials) is Critical in Electronic Product Development

post on January 23, 2024

Why a BOM (Bill of Materials) is Critical in Electronic Product Development

A Bill of Materials (BOM) is a list of materials required for the production of an electronic product. It serves as an important bridge between the designer, manufacturer, and supplier. The BOM includes all the components, devices, and materials used in an electronic product, with information such as their type, model, quantity, manufacturer, and supplier listed.

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Management, Manufacture     WorkingBear    Views (1,994)     comment (0)
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Jan16
RSS or RTS? Which SMT Profile Should You Choose?

post on January 16, 2024

Should the SMT reflow profile Choosing Between RSS or RTS?

Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, while Workingbear personal uncertainties about its  soldering quality linger.

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Process, Quality, SMT, Soldering     WorkingBear    Views (6,139)     comment (0)
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Jan09
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow

post on January 9, 2024

Possible Causes of Head-in-Pillow (HIP) Phenomenon in SMT Process

The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA (Ball Grid Array) components. Personally, Workingbear think it looks more like a neck or waist, but I believe calling it the “Ball and Socket” or “Double Balls” Phenomenon seems more appropriate.

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Quality, SMT, Soldering     WorkingBear    Views (3,047)     comment (0)
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