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Category Archives: Soldering
Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?
The “SMT dispensing” process, also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB). The term “SMT Red Glue” … Continue reading
Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH
The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading
Oct26
5 Key PCB Layout Considerations for Efficient Circuit Board Assembly and Soldering Production Processes
When designing a PCB layout, various questions inevitably arise. Is this PCB best suited for a single-layer, double-layer, or multi-layer configuration? How should you protect against ESD/EMI? Will the printed circuit board assembly (PCBA) use a single-sided or double-sided process? … Continue reading
Oct04
How to Evaluate the Risk and Probability of Electronic Components Not Falling Off during SMT Second Reflow
PCB assembly through SMT double-sided reflow soldering has become the mainstream process in contemporary electronic manufacturing. However, occasionally, many individuals inquire, “Is there a method to proactively determine, or is there any calculation formula to predict the risk or rate … Continue reading
Aug17
An Option for Adding More Solder – Solder Preforms
“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading
