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Category Archives: Soldering
Dec05
How Preventing Heavy Components from Falling during Secondary time SMT Reflow
With the rapid advancement of mobile communication technology, EMS (Electronic Manufacturing Services) providers worldwide are facing severe labor shortages. Furthermore, the Industry 4.0 trend has heightened the demand for automation in EMS facilities. As a result, many components that were … Continue reading
Nov28
When does SMT require Reflow Carriers and Full Process Carriers?
What is an SMT Reflow Carrier? Why is it sometimes necessary in SMT production? And when do we need an SMT Full Process Carrier? Are there situations where neither is required? The so-called “SMT reflow carriers or reflow templates” are … Continue reading
Nov16
What is SMT Red Glue (Dispensing) process? What are the limitations while use red glue process?
The “SMT dispensing” process, also known as the “SMT Red Glue” process in Asia, is a process where a glue is used to stick Surface Mount Device (SMD) parts to a Printed Circuit Board (PCB). The term “SMT Red Glue” … Continue reading
Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH
The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading
Oct26
5 Key PCB Layout Considerations for Efficient Circuit Board Assembly and Soldering Production Processes
When designing a PCB layout, various questions inevitably arise. Is this PCB best suited for a single-layer, double-layer, or multi-layer configuration? How should you protect against ESD/EMI? Will the printed circuit board assembly (PCBA) use a single-sided or double-sided process? … Continue reading
