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Category Archives: SMT
Nov02
How to Implement Paste-In-Hole (PIH) Process for Through-Hole Devices and Solve Solder Filled Percentage for PTH
The PIH (Paste-In-Hole) process involves directly printing solder paste onto the Plating Through Holes (PTHs) of a PCB (Printed Circuit Board). Subsequently, Through-Hole Devices (THDs) are inserted directly into these holes with pre-applied solder paste. At this point, some of … Continue reading
Oct11
Do PCB Designs Require Reserving Board Edges and Grooves for Routers De-Paneling Machines?
A while back, a netizen asked how the Router de-panel machine cuts PCB panels and whether there’s a need to reserve board edges (break-away) for the Router machine in PCB design. Upon careful consideration, I thought my previous answer might … Continue reading
Oct04
How to Evaluate the Risk and Probability of Electronic Components Not Falling Off during SMT Second Reflow
PCB assembly through SMT double-sided reflow soldering has become the mainstream process in contemporary electronic manufacturing. However, occasionally, many individuals inquire, “Is there a method to proactively determine, or is there any calculation formula to predict the risk or rate … Continue reading
Sep27
What Is Router Cutting for PCB Depaneling? Advantages and Disadvantages Explained
There are several methods to cut and separate pre-panelized PCBs into individual boards, and one commonly adopted approach for thin and finely dimensioned mobile phone PCBs is using a Router Cutting Machine. It offers numerous advantages over V-Cut scoring machines, … Continue reading
Aug31
Why is Panelization and Break-away Tab Necessary in PCB Manufacturing, then De-paneling after PCBA is Completed?
Why is “Panelization” performed during PCB manufacturing? And after surface mounting (SMT) assembly and wave soldering, why is it necessary to go through the additional process of “de-paneling” to separate the individual boards? What is the purpose of the PCB’s … Continue reading
