Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination DFx ECM (Electrochemical migration) ENIG FATP Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary metal dome MFI newbie NWO(Non-Wet-Open) OSP Oxidation Panel & De-panel PIH Popcorn-Effect Problem analysis & solving PTF Reliability Short circuit Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Reliability
Dec19
7 Ways to Identify if a Plastic Factory is Using Re-grind Resin
It’s an open secret in the plastic injection molding industry that re-grind resin is often added during injection. Some manufacturers even claim that, given the current competitive environment and cost-cutting pressures, it’s impossible to make a profit without using some … Continue reading
Dec12
Why Re-grind Resin in Plastic Injection Molding Causes Degradation and Weakens Strength
The use of re-grind resin and recycled material in plastic injection molding is a persistent challenge for engineers. The more re-grind resin or recycled material is added, the more severe the degradation of the plastic becomes. This degradation weakens the … Continue reading
Sep19
Does the Gold Thickness in ENIG PCBs Affect Component Detachment?
Does the Gold Thickness in ENIG PCBs Affect Component Detachment? Do you know how the thickness of the gold layer in ENIG surface-finished PCBs impacts soldering quality? What role does the gold layer play in PCBA soldering? How could the … Continue reading
Aug01
3D CT X-Ray Non-Destructive 3D Tomography Analysis for PCBA and BGA Failures
In recent years, the commercial application of 3D CT X-Ray has become increasingly noteworthy. As the technology matures, more companies are investing in its development, making the equipment more affordable, though still not quite at a consumer-friendly price point. Additionally, … Continue reading
Jul18
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?
In the early days, when electronic component design and manufacturing were still developing, the “burn-in” solution was used to screen out defective electronic components and products. This process allowed early-failing products to be identified and eliminated, preventing defective items from … Continue reading
