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Category Archives: Reliability
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
Dec26
The Relationship Between MFI and Re-grind/Recycle Resin in Plastics
When discussing whether using re-grind resin in plastics leads to degradation, Workingbear sought advice from industry experts. Most professionals agreed that it does cause degradation. However, opinions on whether MFI values can reliably indicate the presence of re-grind resin are … Continue reading
Dec19
7 Ways to Identify if a Plastic Factory is Using Re-grind Resin
It’s an open secret in the plastic injection molding industry that re-grind resin is often added during injection. Some manufacturers even claim that, given the current competitive environment and cost-cutting pressures, it’s impossible to make a profit without using some … Continue reading
Dec12
Why Re-grind Resin in Plastic Injection Molding Causes Degradation and Weakens Strength
The use of re-grind resin and recycled material in plastic injection molding is a persistent challenge for engineers. The more re-grind resin or recycled material is added, the more severe the degradation of the plastic becomes. This degradation weakens the … Continue reading
