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Category Archives: Reliability
Dec26
Another Option for Increasing Solder Volume in SMT – Solder Preforms
“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as … Continue reading
Aug17
An Option for Adding More Solder – Solder Preforms
“Solder preforms” are tiny pieces of solid tin alloy that are already shaped before use. They come in two types of flux contain and flux free. These preforms can be put in certain pads to increase the amount of solder … Continue reading
May30
The Hidden Dangers of Using Overdue PCBs: Can Baking Salvage Them?
All materials actually have its shelf-life, some shorter and some longer than others. So what happens when expired materials are used? Think about what will happens when you eat expired food. What about using expired Printed Circuit Boards (PCBs)?
May18
Clarifying the Concept of Electronic Component Soldering Strength
While organizing an article on the structural analysis of Micro-USB connectors, Workingbear came across an interesting soldering concept that he would like to discuss with everyone. During the product development and NPI verification phase, RD often comes to me, I … Continue reading
Jun19
Increase solder paste volume will improve the MLCC capacitor broken?
Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design … Continue reading
