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Category Archives: Reliability
Mar21
Electronic Product Burn-In and Run-In: What They Are and Their Pros & Cons
In the early days, when electronic component design and manufacturing were still in their infancy, burn-in (B/I) was widely used to screen out defective products. This process helped eliminate early failures before products reached customers, reducing the risk of complaints. … Continue reading
Mar06
What is the Popcorn Effect in PCBs and Electronic Components?
The Popcorn Effect in PCB and electronic components refers to the delamination (board cracking) or formation of bubbles when exposed to high temperatures during soldering. This phenomenon is similar to how popcorn pops—it happens because of trapped moisture inside. When … Continue reading
Jan24
Top ENIG PCB Issues: Black Pad and Phosphorus-Rich Layers Explained with Prevention Tips
With the rapid adoption of smartphones, the trend toward miniaturized electronic products, and the EU’s requirements for lead-free manufacturing, Electroless Nickel Immersion Gold (ENIG) surface treatment PCB has become a popular choice for many electronic products. This is largely due … Continue reading
Dec26
The Relationship Between MFI and Re-grind/Recycle Resin in Plastics
When discussing whether using re-grind resin in plastics leads to degradation, Workingbear sought advice from industry experts. Most professionals agreed that it does cause degradation. However, opinions on whether MFI values can reliably indicate the presence of re-grind resin are … Continue reading
Dec19
7 Ways to Identify if a Plastic Factory is Using Re-grind Resin
It’s an open secret in the plastic injection molding industry that re-grind resin is often added during injection. Some manufacturers even claim that, given the current competitive environment and cost-cutting pressures, it’s impossible to make a profit without using some … Continue reading
