Category Archives: Quality


Jan09
What is HIP/HoP? Uncovering the Causes of Head-in-Pillow Defects in SMT Reflow

post on January 9, 2024

The HIP (Head-in-Pillow) defect looks like a person resting their head on a pillow, not buried inside it. Recently, some people refer to it as HoP (Head-on-Pillow). Both terms refer to the non-wetting defect in the solder joints of BGA … Continue reading →

Quality, SMT, Soldering     WorkingBear    Views (2,819)     comment (0)
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Jan02
SMT Reflow Soldering Temperature Profiles Explanation and Precautions

post on January 2, 2024

The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (11,963)     comment (0)
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Jul27
The Myth of PCB Baking: Can Pre-Baking PCBs Improve Solderability?

post on July 27, 2023

WorkingBear has noticed that many engineers or managers involved in Surface Mount Technology (SMT) have a strong passion for “PCB baking,” but their understanding of the concept might not be very clear. If you browse through discussions on PCB and … Continue reading →

Moisture Sensitive, PCB/FPC/PTF, Process, Quality, SMT, Soldering     WorkingBear    Views (2,944)     comment (0)
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Jul11
Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End

post on July 11, 2023

Lately, many colleagues have been asking WorkingBear for advice on designing BGA (Ball Grid Array) packages to prevent solder joint cracking and improve overall durability. This sudden interest came after a senior manager raised concerns during a new product development … Continue reading →

Design, Glue/adhesive/epoxy/underfill,, Quality, SMT, Soldering     WorkingBear    Views (1,878)     comment (0)
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Jun13
How to Determine Whether Underfill is Needed for BGA?

post on June 13, 2023

A question from a netizen, “In the past, many mobile phone PCB assemblies would use Underfill depositing under the BGA package to enhance the mechanical strength of the solder joints. However, it has been found that most mobile phone assemblies … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (3,567)     comment (0)
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