Seach This Blog
Tag Cloud
AOI Baking BGA Burn/In(B/I) CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Quality
Dec12
Why Re-grind Resin in Plastic Injection Molding Causes Degradation and Weakens Strength
The use of re-grind resin and recycled material in plastic injection molding is a persistent challenge for engineers. The more re-grind resin or recycled material is added, the more severe the degradation of the plastic becomes. This degradation weakens the … Continue reading
Dec05
7 Common Reasons for Elevated MFI (Melt Flow Index) in Plastic Resin Testing
Workingbear’s company recently encountered a quality issue with a plastic product. The problem was, “Why is it that products made from the same type of plastic resin sometimes show normal MFI (Melt Flow Index) values, while others have unusually high … Continue reading
Oct24
Causes and Prevention of PCB Warping and Bending After Reflow
A reader recently asked: “In surface mount assembly, PCBs often warp or bend after going through the reflow process, which can cause issues like open solder joints or tombstoning. How can we overcome this?” To be honest, the reasons behind … Continue reading
Oct17
Benefits and Drawbacks of Using Nitrogen (N2) in SMT Reflow Ovens: Optimizing Soldering Quality and Reducing Oxidation
The primary purpose of adding Nitrogen (N2) to the SMT reflow oven is to reduce oxidation on the soldering surface and improve the wettability of the solder joints. Nitrogen is a colorless, odorless, and chemically inactive gas. It belongs to … Continue reading
Oct03
What Causes Wave-Like Wrinkles or Cracks in Solder Joints After Reflow?
These soldering wrinkles appeared quite a while ago, but Workingbear recently came across a similar situation on an online forum. Thinking others might encounter the same issue, I decided to document it for both personal reference and to share with … Continue reading
