Category Archives: Quality


Apr18
Underfill Techniques for Enhanced BGA and CSP Assembly

post on April 18, 2023

“Underfill” is a process and adhesive originally designed for use with flip-chip devices to enhance the mechanical strength of their solder joints and improve their reliability. Flip-chips made of silicon material have a much lower coefficient of thermal expansion (CTE) … Continue reading →

Glue/adhesive/epoxy/underfill,, Process, Quality     WorkingBear    Views (3,914)     comment (0)
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Apr13
Red Dye Penetration Test to check for BGA solder joint cracking

post on April 13, 2023

The Red Dye Penetration Test also known as Red Dye, is a technique used to inspect for surface-mount technology (SMT) defects such as voids or micro-cracks in the soldering of electronic components. It is a destructive test typically used on … Continue reading →

Process, Quality, SMT, Soldering, Test/Inspection     WorkingBear    Views (6,384)     comment (0)
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Apr11
Why BGA soldering ball always crack(13)? Usage Environment is the Biggest Challenge of Stress Sources

post on April 11, 2023

Congratulations! This article is the last one in this series. You won’t have to listen to WorkingBear ramble on about this boring topic again in the future! Usage Environment is the Biggest Challenge of Stress Sources After discussing the precautions … Continue reading →

Design, PCB/FPC/PTF, Quality, SMT, Soldering     WorkingBear    Views (3,089)     comments (3)
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Jul22
What purpose of alloy metal of Cu, Ag, Zn, Sb, Bi added to solder paste?

post on July 22, 2021

Tin (Sn) based solder is still the best material for PCB (Printed Circuit Board) assembly in the modern industry today. The only difference is the lead (Pb) free from the solder base due to environmental concerns. The melting point of … Continue reading →

Process, Quality, SMT, Soldering     WorkingBear    Views (6,665)     comments (1)
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Dec05
Both solder joint bridging and open solder joint happen at same BGA?

post on December 5, 2018

Is that possible for both solder joint bridging and open solder joint defect occur in the same BGA (Ball Grid Array) or CSP (Chip Scale Package) device? It is rare to observe both solder joint bridging and open solder joint … Continue reading →

Process, Quality, Soldering     WorkingBear    Views (7,478)     comment (0)
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