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Category Archives: Quality
Jul11
What Is the Purpose of Testing Electronic Products? It’s Like Buying Insurance!
Workingbear has been in the electronics industry for several years and has noticed an interesting phenomenon. Almost every new manager will ask the same questions when they come on board: “Why do we need to perform ICT (In-Circuit Test) at … Continue reading
May23
How to Resolve HIP or HoP Soldering Issues in BGA Solder Balls
BGA packages are prone to HIP, also known as HoP defects, during the reflow process, and it is an undeniable fact that the larger the size and the more balls a BGA package has, the more likely HIP is to … Continue reading
May02
Concept Clarification: IMC Layer Fracture Despite the Formation of Effective Solder Joints
In this blog, Workingbear has explored the causes and analysis of soldering cracks and electronic component detachment in several articles. It has consistently mentioned that most of the fractures occurring when electronic components detach happen at the Intermetallic Compound (IMC) … Continue reading
Mar26
What is AOI? What Defects Can 2D AOI Detect in PCB Assembly?
AOI (Auto Optical Inspection) is an automated optical recognition system that has become widely used in the electronics industry for inspecting the quality of soldering, component placement accuracy and the presence of missing components on PCBA (Printed Circuit Board Assembly) … Continue reading
Feb27
What is Graping Solder Defect in SMT Assembly? How to Fix it?
In the reflow soldering process of Surface Mount Technology (SMT) in electronic assembly, the occurrence of “Graping” solder defect refers to the situation where the solder paste does not completely melt and joint together during reflow. Instead, individual solder powders … Continue reading
