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Category Archives: Process
Feb15
NWO (Non-Wet-Open) Defect in BGA Soldering: Causes and Possible Solutions
Recently, many have inquired about how to deal with Non-Wet-Open (NWO) issues when encountering BGA packaged ICs soldering. The defects associated with NWO are quite similar to those of HIP (Head-in-Pillow) and typically occur at the edges and corners of … Continue reading
Jan16
RSS or RTS? Which SMT Profile Should You Choose?
Choosing between RSS (Ramp-Soak-Spike) and RTS (Ramp-To-Spike) for the reflow temperature profile in the SMT (Surface Mount Technology) process has been a constant dilemma for many engineers. Some face pressure from higher-ups to opt for RTS due to cost-saving benefits, … Continue reading
Jan02
SMT Reflow Soldering Temperature Profiles Explanation and Precautions
The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading
Dec26
Another Option for Increasing Solder Volume in SMT – Solder Preforms
“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as … Continue reading
Dec19
Understanding the Impact of Solder Paste and Flux Composition on Electronic Board Assembly Quality
Solder paste is a crucial material in the domain of modern electronic assembly technology. It is used for soldering electronic components onto printed circuit boards (PCBs), this enabling the creation of ever-evolving technological products. The invention of solder paste played … Continue reading
