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Category Archives: Process
Oct31
The Limitations of Using “Mirrored Panels” or “Flipped Panels” in SMT
We all know that when producing PCBs and PCBAs, multiple individual PCBs are usually combined into one larger panel, a process called panelization, to improve production efficiency. Typically, these individual boards are arranged in a neat and consistent manner with … Continue reading
Oct03
What Causes Wave-Like Wrinkles or Cracks in Solder Joints After Reflow?
These soldering wrinkles appeared quite a while ago, but Workingbear recently came across a similar situation on an online forum. Thinking others might encounter the same issue, I decided to document it for both personal reference and to share with … Continue reading
Aug22
What is ENIG Surface Finished for Circuit Boards? What Are Its Advantages and Disadvantages?
ENIG (Electroless Nickel Immersion Gold), also known as immersion gold (Au), chemical Ni/Au, or soft gold, is a type of surface finished for printed circuit boards (PCBs). It is widely used in the assembly of mobile phone circuit boards and … Continue reading
Aug15
Causes of Poor Solderability on HASL Finished PCBs (Data Collection and Analysis)
Workingbear personally doesn’t recommend using HASL (Hot Air Solder Leveling) surface-finished PCBs in today’s SMT reflow processes, especially for double-sided reflow or fine-pitch components located on 2nd side. The defect rate of soldering with HASL is quite high and hard … Continue reading
Jul18
Why Do Electronic Products Need Burn-In? What Are Its Pros and Cons? What Is Run-In?
In the early days, when electronic component design and manufacturing were still developing, the “burn-in” solution was used to screen out defective electronic components and products. This process allowed early-failing products to be identified and eliminated, preventing defective items from … Continue reading
