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Category Archives: Process
Jan02
SMT Reflow Soldering Temperature Profiles Explanation and Precautions
The thriving development of the electronics industry owes much to the invention and improvement of Surface Mount Technology (SMT). Among the various SMT techniques, Reflow Soldering plays a pivotal role. In this discussion, we aim to shed light on some … Continue reading
Dec26
Another Option for Increasing Solder Volume in SMT – Solder Preforms
“Solder preforms” are pre-shaped small solder pieces that can be used to locally increase solder paste volume. They help improve solder quality and strength, addressing the limitations on solder paste caused by using a stencil, and are especially useful as … Continue reading
Dec19
Understanding the Impact of Solder Paste and Flux Composition on Electronic Board Assembly Quality
Solder paste is a crucial material in the domain of modern electronic assembly technology. It is used for soldering electronic components onto printed circuit boards (PCBs), this enabling the creation of ever-evolving technological products. The invention of solder paste played … Continue reading
Dec12
Exploring Double-Sided SMT Reflow Soldering and Key Aspects of Component Placement
In the realm of PCB assembly, the go-to technology in SMT (Surface Mount Technology) is what we call “Full Board Reflow Soldering.” While there are other methods for assembling PCBs, this “Full Board Reflow Soldering” can be divided into two … Continue reading
Nov21
Q&A for Beginners: Understanding SMT Stencils, Component Placement Sequence, DFM, and DFX
This is a query from a user regarding SMT (Surface Mount Technology) processes, focusing on topics such as stencils, determining component placement sequence, and explanations of DFM (Design for Manufacturability) and DFX (Design for Excellence). We believe these questions and … Continue reading
