Seach This Blog
Tag Cloud
8D AOI Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) ENIG FATP Fishbone Flux FVT Gold HASL HIP(Head-In-Pillow) ICT IMC LTS Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Process
Nov13
PCB Edge Removal and De-paneling: Stamp Hole Design
In most PCB (Printed Circuit Board) designs, panels are usually connected using V-cuts or tabs/ribs, and then separated with a V-cut scoring machine or a router de-panel machine. However, besides these two common connection methods, there’s another approach called the … Continue reading
Nov06
PCB Edge Removal and De-paneling: Precautions for Manual Breaking
There are many ways to de-panel or remove the edge rails of a PCB, but the simplest and cheapest method is manual V-cut breaking. However, this method can easily lead to uncontrolled quality issues. Before using manual breaking, it’s important … Continue reading
Oct29
Three Common PCB Panelization Connection Methods: V-cut, Tabs, and Stamp Holes
When producing large volumes of PCBs (Printed Circuit Boards), multiple individual boards are often combined into one large panel. This panelized form is then processed through automated SMT production lines to improve efficiency and reduce costly machine idle time. When … Continue reading
Oct08
What Can an SPI (Solder Paste Inspection) Machine Really Do?
SPI stands for Solder Paste Inspection. If we’re talking about the actual inspection equipment, people usually add “machine” after SPI. But in most cases, when you mention SPI in an SMT factory, everyone just assumes you’re talking about the inspection … Continue reading
Sep25
Big Question: As an Engineer, Do You Prefer R&D or Manufacturing?
If you ask Workingbear, “As an engineer, would you prefer working in R&D or in manufacturing?” (This article may not apply to the semiconductor wafer foundry industry. Rumor has it that wafer fabs in Taiwan are notorious for their brutal … Continue reading
