Seach This Blog
Tag Cloud
AOI Baking BGA CAF Carrier Component drop/detachment Concept Contamination Cpk DFx ECM (Electrochemical migration) EDX/EDS/SEM ENIG FATP Fishbone Flux FVT Glossary Gold HASL HIP(Head-In-Pillow) ICT IMC Manufacturing glossary MFI newbie NWO(Non-Wet-Open) OSP Panel & De-panel PIH Problem analysis & solving Reliability Short circuit small-talk Solder broken crack Soldering Solder paste Stencil Temperature Profile Troubleshooting V-cut Video/Youtube Warpage Wave-soldering X-raySponsor
Categories
- Case study
- Connector
- Corrugated Paper
- Design
- EDX/EDS/SEM/IMC/FTIR
- Fundamental Science
- Glue/adhesive/epoxy/underfill,
- Keypad
- Management
- Manufacture
- Moisture Sensitive
- PCB/FPC/PTF
- Personal Opinion
- Plastic
- Process
- Product Introduction
- Quality
- Reliability
- Role & Responsibility
- SMT
- Soldering
- SPC
- Test/Inspection
- Uncategorized
Bookmarks
Histats
Statcounter
Email Subscription
Category Archives: Process
Jan14
Explaining the Relationship Between BOM, AML, AVL, and MPN
BOMs, AML/AVL, and MPNs are essentially the “recipe” behind electronics manufacturing. All of these terms are closely related to a product’s material list. Understanding what they mean is not difficult—the real challenge is knowing how to apply them effectively to … Continue reading
Jan07
For Beginners: What Is a BOM? How BOM Works with ECO, ECN, and ECR in Electronics Manufacturing
For many people who are new to the electronics manufacturing and assembly industry, BOM and ECO are two very important terms—but also two of the most confusing ones. In this article, I’ll try to explain these concepts in a simple … Continue reading
Dec31
Understanding TAL (Time Above Liquidus) and Why It Matters in PCB Assembly
TAL (Time Above Liquidus) refers to the amount of time during the SMT reflow process when the solder material (such as solder paste) is above its liquidus temperature. You can think of it like ice melting into water and then … Continue reading
Dec03
PCB Edge Removal and De-paneling Methods: A Complete Overview
When making printed circuit boards (PCBs), individual boards are first combined into a big panel board. After components mounting or soldering, they are separated into individual boards using de-paneling tools. This article summarizes the three most common PCB de-paneling methods … Continue reading
Nov13
PCB Edge Removal and De-paneling: Stamp Hole Design
In most PCB (Printed Circuit Board) designs, panels are usually connected using V-cuts or tabs/ribs, and then separated with a V-cut scoring machine or a router de-panel machine. However, besides these two common connection methods, there’s another approach called the … Continue reading
