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Category Archives: PCB/FPC/PTF
Oct24
Causes and Prevention of PCB Warping and Bending After Reflow
A reader recently asked: “In surface mount assembly, PCBs often warp or bend after going through the reflow process, which can cause issues like open solder joints or tombstoning. How can we overcome this?” To be honest, the reasons behind … Continue reading
Sep26
The Role of Immersion Gold and Electroplated Gold in PCB Soldering
Workingbear previously wrote an article about how insufficient gold thickness in the ENIG surface treatment of a PCB led to the oxidation of Electroless Nickel, weakening solder joints and causing components detachment during plug and unplug. However, many sources explain … Continue reading
Sep19
Does the Gold Thickness in ENIG PCBs Affect Component Detachment?
Does the Gold Thickness in ENIG PCBs Affect Component Detachment? Do you know how the thickness of the gold layer in ENIG surface-finished PCBs impacts soldering quality? What role does the gold layer play in PCBA soldering? How could the … Continue reading
Sep12
What Are Hard Gold, Soft Gold, Plated Gold, ENIG, and Flash Gold in PCBs?
In the electronics industry, “gold” is often used on the surface of products. But do you know what hard gold, soft gold, electroplated gold, ENIG (Electroless Nickel Immersion Gold), and flash gold are in printed circuit boards? What are the … Continue reading
Aug22
What is ENIG Surface Finished for Circuit Boards? What Are Its Advantages and Disadvantages?
ENIG (Electroless Nickel Immersion Gold), also known as immersion gold (Au), chemical Ni/Au, or soft gold, is a type of surface finished for printed circuit boards (PCBs). It is widely used in the assembly of mobile phone circuit boards and … Continue reading
